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    • 专利摘要:
    Temperature probe of a thermal control system for use in energy distribution systems. Temperature probe (5) of a thermal control system (7), which comprises: a printed circuit board (PCB) (15) made of ceramic, having a first face (17 (1) and a second face (17 ( 2)), the PCB (15), comprising a temperature detection element (20), a terminal (22), the first end (25 (1)) of the terminal (22), fixed directly in contact with a point (27) measured and the second end (25 (2)) of the terminal (22) touching the first face (17 (1)) of the PCB (15) and the element (20) for detecting the temperature is configured for producing an electrical signal (30) in response to heat; the electrical signal (30) produced by the element (20) being sent by the pair of conductive wires (32 (1-2)) to a unit (12) for controlling a temperature (35) Figure for the abstract: Figure 1
    公开号:FR3085202A1
    申请号:FR1909263
    申请日:2019-08-19
    公开日:2020-02-28
    发明作者:Guang Yang；Solomon R. Titus
    申请人:Siemens Industry Inc；
    IPC主号:
    专利说明:

    Description
    Title of the invention: Temperature probe of a thermal control system for use in energy distribution systems Technological background [0001] 1. Field [0002] Facets of the present invention relate to, generally, to a temperature probe of a thermal control system for use in power distribution systems. The temperature probe comprises an electrically insulating and thermally conductive ceramic material. The temperature probe uses direct contact to a measured fitting and uses wire connections to transmit a signal.
    2. Description of the Related Art [0004] Abnormal situations, such as faulty mounting and overloading, can cause a substantial rise in temperature in power distribution systems. There is therefore a need for a continuous temperature control system to control a rise in temperature in power connection fittings, lugs and cables of various mounting components. A temperature probe is required as an important part of the temperature control system. The temperature probe must be able to be easily mounted, reliably detect temperatures at a measured point, be able to withstand the required system voltage and be within a reasonable price range.
    There are three types of probe concepts, which have been put on the market. A first type of temperature control system uses infrared (IR) probes to detect the temperature. The infrared probe does not directly touch the high voltage system, which eliminates the danger of electrical breakdown. And systems like this are generally inexpensive. However, the fittings measured must be painted in certain colors, usually black, and the painting operation is not pleasant for the user. The IR probe can also receive signals from something other than the measured fitting, which can cause the measurement to be falsified.
    To overcome these drawbacks of IR probes, a second type of temperature control system uses a thermal probe in direct contact with the measured connection and the detection is made by thermocouples or by similar components. To avoid electrical breakdown due to the high system voltage, two signal transmission channels were used between the sensors and the control system. The first is to use fiber optics to return the temperature signal to the control unit. Although satisfying what is required, such a probe design can be costly for end users. The second is to use an accumulator to send a signal from the temperature sensors via wireless connections. Such a process requires battery-powered thermal probes to produce an active signal and thus has the disadvantage of having to replace the battery for maintenance. You also need to make sure you have good wireless connections for a reliable signal reading.
    A third type of temperature control system uses temperature probes supplied with radio frequency. In such systems, one or more antennas are used to send radio frequency signals to the probes attached to the measured connections. At different temperatures, the probes reflect the radio frequency signal at different frequencies, but, by detecting the change in the reflected frequency, the temperature can be detected. Such systems are also expensive and sensitive to antenna-probe arrangements.
    There is therefore a constant need for an appropriate temperature probe of a temperature control system to be used in energy distribution systems, which is capable of providing a reliable temperature reading, while by being inexpensive.
    SUMMARY Briefly, facets of the present invention relate to a temperature probe of a temperature control system for use in energy distribution systems, which can provide a reliable temperature reading, while being inexpensive. The proposed probe uses direct contact to a measured fitting and uses wire connections to transmit a signal. All worries about receiver arrangements (wireless, RF or IR) are eliminated. The temperature probe comprises an electrically insulating and thermally conductive ceramic material. A ceramic printed circuit board (PCB) is reasonably priced, so using such a material significantly lowers the cost of the temperature probe. The use of ceramic PCBs makes the temperature probe less expensive than fiber optics and all other concepts.
    According to an embodiment given by way of illustration of the present invention, there is provided a temperature probe of a thermal control system for use in energy distribution systems, the temperature probe being characterized in that it comprises a ceramic printed circuit board (PCB), having a first face and a second face, the ceramic PCB comprising a temperature detection element, disposed on the second face of the ceramic PCB. The temperature probe has a terminal, having a first end and a second end, the first end of the terminal being configured to be fixed directly in contact with a measured point and the second end of the terminal directly touching the first face of the PCB. ceramic, so as to conduct heat from the terminal to the temperature sensing element, passing through the ceramic PCB, the temperature sensing element is configured to produce an electrical signal in response to the heat. The temperature sensor also has a pair of conductor wires. The electrical signal, produced by the temperature sensing element, is sent by the pair of wires to a control unit to control a temperature. The temperature probe also has an epoxy to seal part of the terminal, the entire ceramic PCB and part of the pair of conductive wires, to provide desired physical strength and desired dielectric strength.
    Preferably:
    - the terminal comprises a material of high thermal conductivity, the terminal being configured to conduct heat from the measured point to the temperature detection element and the terminal providing a means for connecting the temperature probe to the measured point;
    - the terminal is an annular terminal, configured to be bolted to the measured point;
    - the terminal is a cylindrical tube, configured to be attached to cables by wire ties;
    - the ceramic PCB provides dielectric insulation between the terminal, which is a high voltage part, and the temperature sensing element, which is a low voltage part;
    - the ceramic PCB includes a material with high thermal conductivity;
    - to ensure good heat conduction, both the terminal and the temperature sensing element are soldered directly to the ceramic PCB;
    - a heat conducting grease is placed between the terminal and the ceramic PCB and between the temperature detection element and the ceramic PCB;
    - the temperature detection element is a thermocouple;
    - the epoxy is either an insulating epoxy used for sealing, or a plastic material in which the sealing is carried out by an injection molding operation.
    According to an embodiment of the present invention given by way of illustration, there is provided a temperature control system for use in energy distribution systems. The temperature control system includes a control unit for controlling the temperature and a temperature probe coupled to the control unit. The temperature sensor is according to the invention.
    BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates a top view and a side view of a temperature probe (without epoxy or plastic) of a temperature control system for use in energy distribution systems, in accordance with an exemplary embodiment of the present invention.
    FIG. 2 illustrates a top and side view of a temperature probe (without epoxy or plastic) of a temperature control system to be used in energy distribution systems, in accordance with an embodiment given by way of example of the present invention.
    FIG. 3 illustrates a top view of an annular terminal design of a terminal for bolt-on applications according to an embodiment given by way of example of the present invention.
    Figure 4 illustrates a side view of the annular terminal design of the terminal of Figure 3 according to an embodiment given by way of example of the present invention.
    FIG. 5 illustrates a top view of a tube design of a terminal for wire tie applications according to an embodiment given by way of example of the present invention.
    Figure 6 a side view of a tube design of the terminal of Figure 5 according to an embodiment given by way of example of the present invention.
    Figure 7 illustrates an elevational view of the tube design of the terminal of Figure 5 according to an embodiment given by way of example of the present invention.
    Description of the embodiments To facilitate the understanding of embodiments, principles and characteristics of the present invention, which are explained below with reference to the implementation in embodiments given by way of illustration . They are described, in particular, in the context of a temperature sensor (with epoxy or plastic) of the temperature control system to be used in energy distribution systems. The temperature probe comprises a printed circuit board (PCB) made of ceramic, made of a ceramic material, electrically insulating and thermally conductive. The temperature probe uses direct contact to a measured fitting and uses wire connections to emit a signal. The temperature sensor provides a continuous temperature control system to control a temperature rise in fittings, lugs and connection cables of various mounting components. The temperature sensor mounts easily, reliably detects temperatures at a measured point, is able to withstand any required system voltage and is in a reasonable price range. However, embodiments of the present invention are not limited to use in the devices or methods described.
    The components and materials described below, as constituting the various embodiments, are given by way of illustration and not limitation. Many suitable components and materials, which would perform the same or similar function as the materials described, are within the scope of the present invention.
    According to an embodiment of the present invention, Figure 1 shows a representation of a temperature probe (without epoxy or plastic) 5 of a temperature control system 7, for use in a system 10 of energy distribution, according to an embodiment given by way of example of the present invention. The temperature control system 7 comprises a control unit 12 for controlling the temperature. The temperature control system 7 includes a temperature probe 5, coupled to the control unit 12 (although this is generally a correct illustration, the exact arrangement is that each probe leads to a module and that a group of modules are connected in a control unit). The temperature probe 5 comprises a printed circuit board (PCB) 15 made of ceramic, having a first face 17 (1) and a second face 17 (2). The ceramic PCB 15 comprises a temperature detection element 20, disposed on the second face 17 (2) of the ceramic PCB 15. The temperature probe 5 comprises a terminal 22, having a first end 25 (1) and a second end 25 (2). The first end 25 (1) of terminal 22 is configured to be fixed directly in contact with a measured point 27 and the second end 25 (2) of terminal 22 directly touches the first face 17 (1) of PCB 15 in ceramic, so as to conduct heat from terminal 22 to element 20 for temperature detection, passing through PCB 15 made of ceramic.
    The ceramic PCB 15 can be, for example, a ceramic material, which is mineral, non-metallic, often made of crystalline oxide, nitride or carbide. Certain elements, such as carbon or silicon, can be considered as ceramics. Ceramic materials are fragile, hard and resistant to compression, but little to shear and tensile. The crystallinity of ceramic materials ranges from very oriented to semi-crystalline, vitrified, and often completely amorphous (for example, glasses). Most often, kiln-fired ceramics are vitrified or semi-vitrified. By varying the crystallinity and the consumption of electrons in ionic and covalent bonds, most ceramic materials are good thermal and electrical insulators. Ceramics can generally withstand very high temperatures, such as temperatures ranging from 1,000 ° C to 1,600 ° C. Glass is often considered not to be ceramic because of its amorphous (non-crystalline) character. But, making glass involves several stages of the ceramic process and its mechanical properties are similar to ceramic materials. Crystal ceramic materials cannot be subjected to much treatment. The glass is shaped when it is completely melted, by pouring, or when it is in a caramel state, by methods such as insufflation in a mold. If the last heat treatments cause this glass to become partially crystalline, the material obtained is known as being a ceramic glass.
    The physical properties of a ceramic substance in ceramic PCB 15 result directly from its crystal structure and its chemical composition. Solid state chemistry reveals the fundamental link between microstructure and properties, such as localized density variations, particle size distribution, type of porosity and secondary phase content, all of which can be brought into play. correlation with ceramic properties, such as mechanical resistance σ by the Hall-Petch equation, hardness, toughness, dielectric constant and optical properties presented by transparent materials. Mechanical properties are important in structural and building materials as well as in textile fabrics. They include many properties used to describe the strength of materials, such as: elasticity / plasticity, tensile strength, compressive strength, shear strength, fracture strength & ductility (small in brittle materials), and hardness to the imprint. Some ceramics are semiconductors. Most of them have transition metal oxides, which are II-VI semiconductors, such as zinc oxide. The ceramic PCB 15 may be, for example, of a ceramic material, which has high dielectric strength and high thermal conductivity.
    In operation, the temperature detection element 20 is configured to produce an electrical signal (30) in response to heat. The temperature probe 5 further comprises a pair of conductive wires 32 (1-2). The electrical signal 30 produced by the temperature sensing element 20 is sent by the pair of conductive wires 32 (1-2) to the control unit 12 to control a temperature 35. The terminal 22 comprises a material with a high thermal conductivity. Terminal 22 is configured to conduct heat from point 27 measured to temperature sensing element 20 and terminal 22 provides means for connecting the temperature probe 5 to point 27 measured. Terminal 22 can be an annular terminal, configured to be bolted to point 27 measured. Terminal 22 can be a cylindrical tube, configured to be attached to cables by wire ties.
    The temperature probe 5 further comprises an epoxy (not shown) for sealing part of the terminal 22, the ceramic PCB 15 as a whole and part of the pair of wires 32 (1-2) conductors to provide desired physical strength and desired dielectric strength. Epoxy is either an insulating epoxy or a plastic. The epoxy is used to release the mechanical stress when the temperature probe 5 is manipulated.
    The ceramic PCB 15 provides dielectric insulation between the terminal 22, which is a high voltage part and the temperature detection element 20, which is a low voltage part. The ceramic PCB 15 provides heat conduction from terminal 22 to temperature sensing element 20. The ceramic PCB 15 comprises a material of high thermal conductivity. The material with high thermal conductivity can be, for example, aluminum nitride.
    To ensure good heat conduction, both the terminal 22 and the temperature detection element 20 are soldered directly to the ceramic PCB 15. A heat conductive grease (not shown) can be placed between the terminal 22 and the ceramic PCB 15 and between the temperature detection element 20 and the ceramic PCB 15. In one embodiment, the temperature detection element 20 can be a detection chip, such as TI LMT01.
    The element 20 for detecting the temperature can be a thermocouple. This thermocouple can be an electrical device consisting of two dissimilar electrical conductors forming electrical junctions at different temperatures. A thermocouple of this kind produces a voltage, which depends on the temperature as a result of the thermoelectric effect, and this voltage can be interpreted to measure the temperature. The thermocouple can be self-powered and does not require an external form of excitation. When different metals are joined at the ends and when there is a temperature difference between the joined parts, a magnetic field is observed. The magnetic field is due to a thermoelectric current. The tension produced at a single junction of two different types of wire is what is interesting, since it can be used to measure a temperature at very high and low temperatures. The magnitude of the tension depends on the types of thread used. In general, the voltage is of the order of a microvolt and care must be taken to obtain a measurement which can be used from a very small current flow. In the standard configuration for use thermocouple, the temperature T desired sense is achieved by using three inputs - the function E (T) characteristic of the thermocouple, the voltage V measured, and the temperature T ref reference junction. The solution of the equation E (T sense ) = V + E (T iei ) gives T sense . The measured voltage V can be used to calculate the temperature T sense provided that the temperature T ref is known. To obtain the desired measurement of T sense , it is not sufficient to measure only V. It is already necessary to know the temperature at the reference T ref junctions. Thermocouples, as measuring devices, are characterized by a precise E (T) curve, independent of any other detail. Characteristic functions of thermocouples, which reach intermediate temperatures, are covered by types of nickel-alloy thermocouple, E, J, K, M, N, T.
    The ceramic PCB 15 serves two purposes. Firstly, it provides dielectric isolation between the high voltage part (terminal 22) and the low voltage part (temperature detection element 20). Second, it provides heat conduction from terminal 22 to sensing element 20. A ceramic generally has a wide range of thermal conductivity. To obtain good heat conduction, a material with high thermal conductivity, such as aluminum nitride, must be used. To also ensure good heat conduction, both the terminal 22 and the heat detection element 20 are soldered directly to the ceramic PCB 15. If solder is not used, good conductive grease or the like can be used between components. The temperature sensing element 20 can be a thermocouple or another type of temperature probe. The electrical signal 30 produced by the temperature detection element 20 is then transmitted by the pair of conductive wires 32 (1-2) to the control unit 12 for controlling the temperature.
    Referring to Figure 2, it illustrates a representation of a temperature probe 200 (with epoxy or plastic) of the temperature control system 7 to be used in the energy distribution system 10 according to a embodiment given by way of example of the present invention. The temperature probe 5 includes an epoxy 217 to seal part of the terminal 22, the PCB 15 in ceramic as a whole and part of the pair of conductive wires 32 (1-2), in order to ensure a desired physical resistance. and a desired dielectric strength. Epoxy 217 is either an insulating epoxy used for sealing or a plastic material, in which the sealing is done by an injection molding operation. The epoxy 217 is used to release the mechanical stress when the temperature probe 5 is manipulated. The temperature probe 200 further comprises a plastic casing 220 arranged around the epoxy 217.
    Turning now to Figure 3, it illustrates a top view of a design 300 in annular lug of the terminal 22 for bolted applications according to an embodiment given by way of example of the present invention. Part of the terminal ring design 300 of terminal 22, which is inside the epoxy 217, has a retaining slot 305, which is filled with epoxy, so that when the terminal 22 is pulled, the holding slot 305 acts directly on the epoxy 217 instead of relying on a surface bond, to ensure that a force does not act on a junction of the PCB.
    Figure 4 illustrates a side view of the design 300 in annular terminal of the terminal 22 of Figure 3 according to an embodiment given by way of example of the present invention. The annular terminal design 300 may include a ring 400 and a rod 405 moving away from the ring 400. The ring 400 and the rod 405 may be made of a metal or a metal alloy, such as copper or aluminum. The design 300 in annular terminal may include a bend 410 between the ring 400 and the rod 405, so that the ring 400 and the rod 405 may not be at the same level. In particular, the ring 400 will be at a level 415 (1) lower than a level 415 (2) of the rod (405) when the temperature probe 5 or 200 is laid flat on a surface.
    Figure 5 is a top view of a tube design 500 of terminal 22 for wire tie applications according to an embodiment given by way of example of the present invention. Part of the terminal tube design 500 22, which is inside the epoxy 217, has a retaining slot 505, which is filled with epoxy. The 500 tube design may include a pair of 510 wings (1-2) and a rod 515 moving away from the pair of 510 wings (1-2). The pair of wings 510 (1-2) and the rod 515 can be made of a metal or a metal alloy, such as copper or aluminum. The 500 tube design may include an elbow 520 (see Figure 6) between the pair of wings 510 (1-2) and the rod 515, so that the pair of wings 510 (1-2) and the rod 515 may not be at the same level. In particular, the pair of wings 510 (1-2) will be at a lower level than the rod 515, when the temperature probe 5 or 200 is placed on a surface.
    Figure 6 is a side view of the design 500 in tube of the terminal 22 of Figure 5 according to an embodiment given by way of example of the present invention. Terminal 22 serves two purposes. First, it conducts heat from point 27 measured at the temperature sensing element 20 and must therefore be made of a material with high thermal conductivity, such as copper. Second, it provides a means for connecting the temperature probe 5 to the point 27 measured. In one configuration, as shown in Figure 3, the terminal 22 is an annular lug, which can be bolted to the connector 27 measured. In another configuration, as shown in Figure 5, the terminal 22 is a cylindrical tube, which can be attached to cables by wire ties.
    Figure 7 is an elevational view of the design 500 in a tube of the terminal of Figure 5 according to an embodiment given by way of example of the present invention. In the 500 tube design, the pair of wings 510 (1-2) forms a cylindrical tube, which can be attached to cables with wire ties.
    An important technical challenge to be met is the high dielectric strength, which is necessary. To ensure this, part of the terminal 22, the entire ceramic PCB 15 and part of the pair of conductive wires 32 (1-2) are sealed in an insulating epoxy. The chosen 217 epoxy has high dielectric strength to create sufficient insulation between the low voltage parts inside and the high voltage part outside. The insulating epoxy can also be used to release the mechanical stress, when the temperature probe 5,200 is manipulated. An example is shown in Figure 3. The part of terminal 22, which is inside the epoxy 217 has the retaining slot 305, which is filled with epoxy, instead of being flat. When terminal 22 is pulled, the retaining slot 305 can act directly on the epoxy 217, instead of relying on a surface bond, and can ensure that the force does not act on the PCB connector . Similar concepts can also be used on the side of the conducting wires, although this is not shown here. One can choose an epoxy having a high bond strength with the wire insulation or intermediate components, such as crimps or terminals, can be used to insulate the fitting on the ceramic PCB. If more resistance is required, the plastic housing 220 can be used around the epoxy.
    Products, such as distribution panels, switches, electrical equipment, busbar systems, etc. are integrated into energy control products. A temperature control system for a branch circuit provides a good solution in an ecosystem with control capabilities. By incorporating the temperature control system 7 into distribution panels, switches, electrical equipment, bus bar systems, the product offering is increased from the customer's point of view. The temperature sensor 5 is an important component of the temperature control system 7 and is decisive for the bypass circuit temperature control system.
    Although a temperature sensor based on a thermocouple has been described so far, it is envisaged, in the present invention, a range of one or more other types of temperature probes. It is possible to use, for example, other types of temperature probes based on one or more characteristics presented above, without departing from the spirit of the present invention. Thermistors are thermally sensitive resistors, the primary function of which is to present a large, predictable and precise change in electrical resistance, when subjected to a corresponding change in body temperature. Resistance thermometers, also called resistance temperature detectors (RTDs), are sensors used to measure temperature. A silicon band gap temperature probe is an extremely common form of temperature probe (thermometer) used in electronic equipment.
    Techniques described in this specification may be particularly useful for a temperature control system for use in energy distribution systems. Although particular embodiments are described in terms of the temperature control system incorporated in distribution panels, switches, electrical equipment, bus bar systems, the techniques described herein are not limited to energy distribution system, cannot also be used with other systems, devices or analog or digital circuits.
    The ceramic PCB 15 can be a printed circuit board with a metal core (MCPCB). Ceramic printed circuit boards are a type of metal core PCB. One of the main reasons why other PCBs would be avoided compared to a ceramic printed circuit board or another MCPCB board is due to heat transfer. Metal cores, such as aluminum nitride and beryllium oxide are extremely heat conductive. Other metal core PCB materials, in addition to aluminum and beryllium, may include copper and a steel alloy. Steel alloys provide stiffness not available with copper and aluminum, but are not as effective at transferring heat. Copper has the best ability to transfer and dissipate heat, as part of printed circuit board, but it is somewhat expensive, so that one can opt for aluminum, as a cheaper solution, but still very effective in dissipating heat. The least expensive solutions will be printed circuit boards with a metal core, having an aluminum base. Good rigidity and good thermal conductivity are obtained at a more reasonable price. The reason why metal core PCBs are somewhat more efficient at dissipating heat than fr4 wafers is due to their thermally conductive dielectric material, which acts as a thermal bridge from the printed circuit board components to the metal plate, by automatically conducting heat through the core to a heat sink. Metal core printed circuit boards are available as single-layer PCBs, single-layer chip-on-chip PCBs, double-layer PCBs, double-sided PCBs, and multi-layer PCBs.
    Although embodiments of the present invention have been described by way of example, it goes without saying for those skilled in the art that there can be many modifications, additions and deletions thereof, without departing from the spirit and scope of the invention and its equivalents.
    Embodiments and their various characteristics and advantageous details are explained more fully with reference to the non-limiting embodiments, which are illustrated in the accompanying drawings and described in detail in the description which follows. Descriptions of material, departures, processing techniques, components and well known equipment are omitted, so as not to obscure, without necessity, detailed embodiments. However, it goes without saying that the detailed description and specific examples, while indicating preferred embodiments, are given by way of illustration only and, in no way, are limiting. Various replacements, modifications, additions and / or rearrangements, within the scope and / or in the spirit of the underlying inventive concept, will appear to those skilled in the art from this discussion.
    As used herein, the terms "include", "comprising", "included", "including", "a", "having" or any other variation are intended to open a non-exclusive inclusion. For example, a process, an object or a device, which includes an enumeration of elements, is not necessarily limited to only these elements, but may include other elements not expressly listed or inherent in such a process, object or device .
    In addition, any examples or illustrations given in this memo should not be considered in any way as restrictions, limits or as expressing definitions of any terms with which they are used. Instead, these examples or illustrations should be considered as being described in relation to a particular embodiment and only by way of illustration. Those skilled in the art will understand that any term with which these examples or illustrations are used will encompass other embodiments, which may or may not be given with him or elsewhere in the disclosure and the intention is to include all of these embodiments within the scope of these terms.
    In the previous description, the invention has been described with reference to specific embodiments. However, those skilled in the art will understand that various modifications and changes can be made thereto without departing from the scope of the invention. This is why the description and the figures must be looked at in an illustrative rather than restrictive sense and it is intended to include in the scope of the invention any modifications of this kind.
    Although the invention has been described by these specific embodiments, these embodiments are only illustrative and not limiting of the invention. The description of embodiments of the invention is not intended to be exhaustive or to limit the invention to the precise forms, which are described (and in particular, the inclusion of any particular embodiment, characteristic or function is not not intended to limit the scope of the invention to an embodiment, a characteristic or a function of this kind). Rather, the intention is that the description described of the embodiments, characteristics and functions by way of illustration, in order to provide a person skilled in the art with the context necessary to understand the invention, without however limiting the invention to a mode of achievement, a characteristic or a function particularly described. Although specific embodiments and examples have been described here for purposes of illustration, various equivalent modifications can be made without departing from the spirit and scope of the invention, as the skilled in the art. As noted, these modifications can be made to the invention in light of the foregoing description of embodiments of the invention and should be encompassed within the spirit and scope of the invention. Thus, although the invention has been described in the present specification with reference to these particular embodiments, the intention is to leave room for modification of various changes and substitutions to the preceding presentations and it goes without saying that, in in certain cases, certain characteristics of the embodiments of the invention will be used without a corresponding use of other characteristics, without however going beyond the scope and the spirit of the invention. Many modifications can therefore be made to adapt a particular situation or material to the scope and essential spirit of the invention.
    The phrases "in one embodiment", "in a single embodiment", or "in a specific embodiment" or similar terminology at various points in this discussion does not necessarily refer to the same mode of production. Furthermore, the particular features, structures or features of any particular embodiment can be combined in any suitable manner with another embodiment or with all the other embodiments. It goes without saying that other variations and modifications of the embodiments described in this thesis are possible in the light of the teachings of this thesis and must be considered as part of the spirit of the scope of the invention.
    In the description, numerous specific details have been provided, such as examples of components and / or methods, to give an in-depth understanding of the embodiments of the invention. Those skilled in the art will recognize, however, that one embodiment can be practiced without one or more of the specific details or with other devices, systems, assemblies, processes, components, materials, parts, and / or the like. In other cases, well-known structures, components, systems, materials or operations are not shown or specifically described in detail to avoid obscuring aspects of embodiments of the invention. Although the invention can be illustrated using a particular embodiment, this is not a limitation and does not limit the invention to any particular embodiment and those skilled in the art will recognize that modes of additional embodiments can be easily understood and are part of this invention.
    It is also understood that one or more of the elements described in the drawings / figures can also be implemented in a more separate or integrated manner, or even withdrawn or made inoperative in certain cases, depending on whether this is useful. to a particular application.
    The benefits, other advantages and solutions to the problems have been described above with reference to specific embodiments. However, the benefits, advantages, solutions to problems and any components that may cause a benefit, advantage or solution to occur or become more pronounced are not to be considered as a necessary or essential defining characteristic or component.
    权利要求:
    Claims (1)
    [1" id="c-fr-0001]
    [Claim 1] [Claim 2] [Claim 3] [Claim 4]
    Claims
    Temperature probe (5) of a thermal control system (7) for use in energy distribution systems (10), the temperature probe (5) being characterized in that it comprises:
    a ceramic printed circuit board (PCB) (15) having a first face (17 (1)) and a second face (17 (2)), the ceramic PCB (15) comprising a detection element (20) temperature, disposed on the second face (17 (2)) of the ceramic PCB (15);
    a terminal (22), having a first end (25 (1)) and a second end (25 (2)), the first end (25 (1)) of the terminal (22) being configured to be fixed directly in contact with a measured point (27) and the second end (25 (2)) of the terminal (22) directly touching the first face (17 (1)) of the ceramic PCB (15), so as to conduct heat from the terminal (22) to the temperature detection element (20), passing through the ceramic PCB (15) and in which the temperature detection element (20) is configured to produce a signal ( 30) electric in reaction to heat;
    a pair of conductive wires (32 (1-2)), the electrical signal (30) produced by the temperature sensing element (20) being sent by the pair of wires (32 (1-2)) conductors to a control unit (12) for controlling a temperature (35) and an epoxy (217) for sealing part of the terminal (22), the whole ceramic PCB (15) and part of the pair of conductive wires (32 (1-2)), to provide a desired physical strength and a desired dielectric strength.
    Temperature probe (5) according to claim 1, characterized in that the terminal (22) comprises a material of high thermal conductivity, the terminal (22) being configured to conduct heat from the point (27) measured at the temperature sensing element (20) and terminal (22) providing means for connecting the temperature probe (5) to the point (27) being measured.
    Temperature probe (5) according to claim 1 or 2, characterized in that the terminal (22) is an annular terminal, configured to be bolted to the point (27) measured.
    Temperature probe (5) according to one of claims 1 or 2, ca15
    characterized in that the terminal (22) is a cylindrical tube, configured to be attached to cables by wire ties. [Claim 5] Temperature probe (5) according to one of the preceding claims, characterized in that the ceramic PCB (15) provides dielectric insulation between the terminal (22), which is a high-voltage part, and the element (20 ) temperature detection, which is a low voltage part. [Claim 6] Temperature probe (5) according to any one of the preceding claims, characterized in that the ceramic PCB (15) comprises a material of high thermal conductivity. [Claim 7] Temperature probe (5) according to Claim 1 or 2, characterized in that, to ensure good heat conduction, both the terminal (22) and the temperature detection element (20) are welded directly to the ceramic PCB (15). [Claim 8] Temperature probe (5) according to any one of the preceding claims, characterized in that a heat-conducting grease is placed between the terminal (22) and the ceramic PCB (15) and between the element (20) temperature detection and ceramic PCB (15). [Claim 9] Temperature probe (5) according to any one of the preceding claims, characterized in that the element (20) for detecting the temperature is a thermocouple. [Claim 10] Temperature probe (5) according to any one of the preceding claims, characterized in that the epoxy (217) is either an insulating epoxy used for sealing, or a plastic material in which the sealing is carried out by a molding operation by injection.
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    同族专利:
    公开号 | 公开日
    GB2576595A|2020-02-26|
    US20200064207A1|2020-02-27|
    CN110857888A|2020-03-03|
    GB201907564D0|2019-07-10|
    DE102019211733A1|2020-02-27|
    US10852198B2|2020-12-01|
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    法律状态:
    2020-07-24| PLSC| Search report ready|Effective date: 20200724 |
    2020-08-13| PLFP| Fee payment|Year of fee payment: 2 |
    2021-08-17| PLFP| Fee payment|Year of fee payment: 3 |
    优先权:
    申请号 | 申请日 | 专利标题
    US16/111,687|2018-08-24|
    US16/111,687|US10852198B2|2018-08-24|2018-08-24|Temperature sensor of thermal monitoring system for use in power distribution systems|
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